Monitoring multiple sequential signals on a single observation pad
AssigneeQUALCOMM Incorporated
InventorsYuxin LI, Asha CHANNAMALLA SWAMY, Vikas MAHENDIYAN
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AssigneeQUALCOMM Incorporated
InventorsYuxin LI, Asha CHANNAMALLA SWAMY, Vikas MAHENDIYAN
Estimating the term…
A chip includes a first modulator configured to receive a first internal signal, and convert the first internal signal into a first output signal including a first pattern, and a second modulator configured to receive a second internal signal, and convert the second internal signal into a second output signal including a second pattern distinct from the first pattern. The chip also includes an observation pad, and a merge circuit coupled to the observation pad, wherein the merge circuit is configured to merge the first output signal and the second output signal into a merged output signal, and output the merged output signal to the observation pad, wherein the merged output signal includes the first pattern and the second pattern, and the first pattern and the second pattern are spaced apart in the merged output signal.
A chip, comprising:
A chip, comprising:
A method for signal monitoring, comprising:
Dependencies are inferred from the claim text.