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US 2026/0171779 A1Published application
Modular cryogenic interconnects and quantum computing systems
AssigneeInternational Business Machines Corporation
InventorsAshutosh Rao, Stephen W. Bedell
Life of this patent
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Abstract
A system can include two or more cryogenic chambers, modularly connected via a cryogenic connector, wherein the connector forms a vacuum tight seal between the cryogenic chambers. The connector can comprise a fixed signal carrying member that connects a cryogenic signal carrying member within a first cryogenic chamber to a second signal carrying member in a second cryogenic chamber.
Claims20
A system, comprising:
- two or more cryogenic chambers, modularly connected via a cryogenic connector, wherein the connector forms a vacuum tight seal between the cryogenic chambers.
A structure, comprising:
- a cryogenic connector, wherein the connector forms a vacuum tight seal between at least two cryogenic chambers.
A method for preparing superconducting quantum computers for servicing, comprising:
- modularly connecting two or more dilution refrigerators to one or more shared cryogenic interconnect hubs via cryogenic connectors;
- isolating each dilution refrigerator from the cryogenic interconnect hubs and from each other via the cryogenic connectors;
- heating and venting at least one of the two or more dilution refrigerators in preparation for service.
Dependencies are inferred from the claim text.