Substrate treating apparatus

A substrate treating apparatus comprising:

• a chamber housing;
• a substrate support in the chamber housing and configured to support a substrate;
• a process gas supply connected to the chamber housing and configured to supply a process gas;
• and
• a plasma generator configured to generate plasma in the chamber housing using a microwave,
• wherein the plasma generator comprises:
• an antenna;
• a connector connecting the antenna to a coaxial cable configured to provide the microwave;
• a cover covering the antenna;
• and
• a microwave transmission portion connected to the connector,
• wherein at least a portion of the antenna and at least a portion of the cover are inside the microwave transmission portion,
• wherein the connector seals an inside of the microwave transmission portion in a vacuum state, and
• wherein the process gas supply is configured to supply the process gas to an inner space of the chamber housing via the plasma generator.

A substrate treating apparatus comprising:

• a chamber housing;
• a substrate support in the chamber housing and configured to support a substrate;
• a process gas supply connected to the chamber housing and configured to supply a process gas;
• and
• a plasma generator configured to generate plasma in the chamber housing using a microwave,
• wherein the plasma generator comprises:
• an antenna;
• a connector connecting the antenna to a coaxial cable configured to provide the microwave;
• a cover covering the antenna;
• and
• a microwave transmission portion connected to the connector,
• wherein at least a portion of the antenna and at least a portion of the cover are inside the microwave transmission portion,
• wherein the connector seals an inside of the microwave transmission portion in a vacuum state,
• wherein the process gas supply is directly connected to the chamber housing, and
• wherein the plasma generator is directly connected to the chamber housing.