US 2026/0171323 A1Published application

Electronic component

AssigneeTDK Corporation

InventorsAtsuhiro TSUYOSHI, Takashi OHTSUKA, Yoshinori UCHIYAMA, Yu FUKAE, Yukari TANZAWA, Takeshi OOHASHI

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Abstract

An electronic component includes: an insulating layer covering the surface of a substrate; an adhesion layer provided on the surface of the insulating layer and extending so as to surround at least a first area which is a partial area of the insulating layer; a lower electrode pattern provided in the first area; an insulating layer provided in the first area so as to cover the lower electrode pattern; an upper electrode pattern covering the lower electrode pattern through the insulating layer; and an interlayer insulating film provided on the insulating layer and embedding therein the adhesion layer, lower electrode pattern, insulating layer, and upper electrode pattern. The edge of the insulating layer is positioned on the adhesion layer.

Claims14

Dependent claims

An electronic component comprising:

a substrate;
a first insulating layer covering a surface of the substrate;
an adhesion layer provided on a surface of the first insulating layer and extending so as to surround at least a partial area of the first insulating layer;
a lower electrode pattern provided in a first area of the first insulating layer that is surrounded by the adhesion layer;
a second insulating layer provided in the first area so as to cover the lower electrode pattern;
an upper electrode pattern covering the lower electrode pattern through the second insulating layer;
and
an interlayer insulating film provided on the first insulating layer and embedding therein the adhesion layer, the lower electrode pattern, the second insulating layer, and the upper electrode pattern,
wherein an edge of the second insulating layer is positioned on the adhesion layer.

6 more elements

Dependencies are inferred from the claim text.