US 2026/0169467 A1Published application

Substrate processing apparatus

AssigneeEbara Corporation

InventorsMitsuru MIYAZAKI, Katsuhide WATANABE, Satoshi YAMANAKA, Kenichi KOBAYASHI

Life of this patent

Estimating the term…

Loading patent…

Abstract

Disclosure relates to a substrate processing apparatus that can quickly transport a substrate to a cleaning module after surface processing of the substrate is performed. The substrate processing apparatus includes processing units each for processing a substrate and a relay transporter that transports the substrate between the processing units. Each processing unit includes a surface-processing module, a cleaning module, a drying module, a substrate transporter extending from one side to opposite side of each processing unit, and a processing transporter that transports the substrate from the substrate transporter to the surface-processing module and from the surface-processing module to the cleaning module.

Claims20

Dependent claims

A substrate processing apparatus comprising:

a first processing unit and a second processing unit each for processing a substrate;
and
a relay transporter configured to transport the substrate between the first processing unit and the second processing unit,
wherein each of the first processing unit and the second processing unit comprises:
a surface-processing module configured to perform surface processing on the substrate;
a cleaning module configured to clean the substrate;
a drying module configured to dry the cleaned substrate;
a substrate transporter extending from one side to opposite side of each processing unit, and
a processing transporter configured to transport the substrate from the substrate transporter to the surface-processing module, and from the surface-processing module to the cleaning module,
wherein the surface-processing module of one of the first processing unit and the second processing unit is any one of:
a CMP module configured to chemically mechanically polish a surface of the substrate;
a bevel polishing module configured to polish a peripheral edge of the substrate;
a partial polishing module configured to polish a portion of the surface of the substrate;
a backside polishing module configured to polish a backside of the substrate;
and
a thinning module configured to thin the substrate by grinding the substrate,
wherein the surface-processing module of other of the first processing unit and the second processing unit is any one of:
the bevel polishing module;
the partial polishing module;
the backside polishing module;
and
the thinning module.

19 more elements

A substrate processing apparatus comprising:

a first processing unit, a second processing unit, and a third processing unit each configured to process a substrate;
a first relay transporter configured to transport the substrate between the first processing unit and the second processing unit;
and
a second relay transporter configured to transport the substrate between the second processing unit and the third processing unit,
wherein each of the first processing unit, the second processing unit, and the third processing unit comprises:
a surface-processing module configured to perform surface processing on the substrate;
a cleaning module configured to clean the substrate;
a drying module configured to dry the cleaned substrate;
a substrate transporter extending from one side to opposite side of each processing unit, and
a processing transporter configured to transport the substrate from the substrate transporter to the surface-processing module, and from the surface-processing module to the cleaning module,
wherein the surface-processing module of one of the first processing unit, the second processing unit, and the third processing unit is any one of:
a CMP module configured to chemically mechanically polish a surface of the substrate;
a bevel polishing module configured to polish a peripheral edge of the substrate;
a partial polishing module configured to polish a portion of the surface of the substrate;
a backside polishing module configured to polish a backside of the substrate;
and
a thinning module configured to thin the substrate by grinding the substrate,
wherein the surface-processing module of other one of the first processing unit, the second processing unit, and the third processing unit is any one of:
the CMP module;
the bevel polishing module;
the partial polishing module;
the backside polishing module;
and
the thinning module, and
wherein the surface-processing module of remaining one of the first processing unit, the second processing unit, and the third processing unit is any one of:
the bevel polishing module;
the partial polishing module;
the backside polishing module;
and
the thinning module.

27 more elements

Dependencies are inferred from the claim text.