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US 2026/0169388 A1Published application
Substrate processing method and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsCongque DINH, Seiji NAGAHARA, Makoto MURAMATSU
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Abstract
A substrate processing method includes developing, using a polar developing material and a non-polar developing material, a substrate on which a film of a negative type metal-containing resist is formed and on which an exposure processing and a heating processing after the exposure processing are performed.
Claims20
A substrate processing method, comprising:
- developing, using a polar developing material and a non-polar developing material, a substrate on which a film of a negative type metal-containing resist is formed.
A substrate processing method, comprising:
- performing exposure processing;
- radiating an ultraviolet ray to an entire surface of a substrate on which a film of a negative type metal-containing resist is formed, before or after the exposure processing on the substrate;
- and
- developing, using a polar developing material, the substrate on which the film is formed.
1 more element
A substrate processing apparatus configured to process a substrate, comprising:
- a developing device configured to develop the substrate, using a polar developing material and a non-polar developing material;
- and
- a controller having a processor and a memory with a computer readable program stored therein that upon execution of the computer readable program by the processor configures the controller to:
- control the substrate processing apparatus to develop the substrate on which a film of a negative type metal-containing resist is formed and on which an exposure processing and a heating processing after the exposure processing are performed, using the polar developing material and the non-polar developing material.
1 more element
Dependencies are inferred from the claim text.