Resist composition, resist pattern formation method, compound, and acid diffusion control agent
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorHiroki Kato
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AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorHiroki Kato
Estimating the term…
A resist composition in which sensitivity and reduction of roughness are further improved and film thickness reduction during development is suppressed, a resist pattern formation method using the resist composition, and a compound useful as an acid diffusion control agent used in the resist composition. The resist composition contains a base material component whose solubility in a developing solution is changed by action of an acid, and a compound represented by General Formula (d0) in which Z represents a polycyclic ring group including a benzene ring; Rd01 represents a substituent; j represents an integer of 0 or greater as long as the valence is allowed; Xd01 represents an iodine atom or a bromine atom; k represents an integer of 1 or greater as long as the valence is allowed; m represents an integer of 1 or greater; and Mm+ represents an m-valent organic cation
A resist composition which generates an acid upon light exposure and whose solubility in a developing solution is changed by an action of the acid, the resist composition comprising:
A compound which is represented by General Formula (d0),
Dependencies are inferred from the claim text.