Method and device for predicting wafer test data
AssigneeDigWise Technology Corporation, LTD
InventorsShih-Hao Chen, Liang-Yu Chen
Life of this patent
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Abstract
Provided are a method and a related electronic device for predicting wafer test data. The method includes: a wafer acceptance test (WAT) data of a wafer is pre-processed to convert a position information of the WAT data in the wafer to a positional embedding vector, and the WAT data has a first quantity of data points; a chip probing (CP) data and the positional embedding vector of the wafer are input into an artificial intelligence model to allow the artificial intelligence model to generate a predicted WAT data of the wafer. The predicted WAT data has a second quantity of data points greater than the first quantity.
Claims13
A method for predicting wafer test data, comprising:
- performing a pre-processing on a wafer acceptance test (WAT) data of a wafer to convert a plurality of position information of the WAT data on the wafer to a plurality of positional embedding vectors, wherein the WAT data has a first quantity of data points;
- and
- inputting a chip probing (CP) data and the positional embedding vectors of the wafer into an artificial intelligence model to allow the artificial intelligence model to generate a predicted WAT data of the wafer, wherein the predicted WAT data has a second quantity of data points greater than the first quantity.
An electronic device for predicting wafer test data, comprising:
- a memory, storing a command;
- and
- a processing circuit, coupled to the memory, wherein the processing circuit is configured to access the command to execute an artificial intelligence model for:
- performing a pre-processing on a wafer acceptance test (WAT) data of a wafer to convert a plurality of position information of the WAT data on the wafer to a plurality of positional embedding vectors, wherein the WAT data has a first quantity of data points;
- and
- inputting a chip probing (CP) data and the positional embedding vectors of the wafer into the artificial intelligence model to allow the artificial intelligence model to generate a predicted WAT data of the wafer, wherein the predicted WAT data has a second quantity of data points greater than the first quantity.
Dependencies are inferred from the claim text.