US 2026/0169059 A1 · TEMPERATURE ADJUSTMENT APPARATUS AND TESTING APPARATUS FOR INTEGRATED CHIP

Abstract

The present application relates to a temperature adjustment apparatus and a testing apparatus for an integrated chip. The temperature adjustment apparatus is applied to an integrated chip testing scene. The temperature adjustment apparatus includes: a first thermoelectric cooling chip, wherein the first thermoelectric cooling chip has a first end surface configured to attach to one side of to-be-tested integrated chip, and is used for absorbing heat from the integrated chip or transferring heat to the integrated chip; and a heat exchange assembly, attached to a second end face of the first thermoelectric cooling chip and used for performing heat exchange with the first thermoelectric cooling chip.

Claims20

Dependent claims

A temperature adjustment apparatus, applied to an integrated chip testing scenario and comprising:

a first thermoelectric cooling chip, a first end face of the first thermoelectric cooling chip is configured to attach to one side of a to-be-tested integrated chip, and is configured to absorb heat from the to-be-tested integrated chip or transfer heat to the to-be-tested integrated chip;
and
a heat exchange assembly, attached to a second end face of the first thermoelectric cooling chip, and configured to perform heat exchange with the first thermoelectric cooling chip.

A testing apparatus for an integrated chip, wherein the testing apparatus comprises:

a test socket, configured to place the to-be-tested integrated chip;
a test board, coupled to the test socket to realize testing of the to-be-tested integrated chip;
and
a temperature adjustment apparatus, configured to perform temperature adjustment in a case of testing the to-be-tested integrated chip, wherein the temperature adjustment apparatus comprises:
a first thermoelectric cooling chip, a first end face of the first thermoelectric cooling chip is configured to attach to one side of a to-be-tested integrated chip, and is configured to absorb heat from the to-be-tested integrated chip or transfer heat to the to-be-tested integrated chip;
and
a heat exchange assembly, attached to a second end face of the first thermoelectric cooling chip, and configured to perform heat exchange with the first thermoelectric cooling chip.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

19/531,690Filed 6 Feb 2026

Priority

7 Aug 2023

Published

18 Jun 2026

Term ends

Not estimatedThe source records don’t support an estimate.

Classification14 codes

G01R 31/2874
Related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation: related to temperature
C12M 1/38
Including condition or time responsive control, e.g. automatically controlled fermentors: temperature-responsive control
F25B 21/02
Machines, plants or systems, using electric or magnetic effects: using Peltier effect; using Nernst-Ettinghausen effect
G01R 31/28
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by…

Temperature adjustment apparatus and testing apparatus for integrated chip

Life of this patent

Temperature adjustment apparatus and testing apparatus for integrated chip

Life of this patent

Abstract

Claims20