Method for evaluating defect position in depth direction of wafer
AssigneeShin-Etsu Handotai Co., Ltd.
InventorHisayuki SAITO
Life of this patent
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Abstract
A method for evaluating a defect position in a depth direction of a wafer using X-ray topography (XRT), the method includes the steps of irradiating a front surface of the wafer that has the front surface and a back surface with an X-ray from a right direction and a left direction at an incident angle satisfying diffraction conditions to obtain two XRT images, being a right-eye image and a left-eye image, on the back surface, position-adjusting to adjust the two obtained XRT images at the defect position on any one of the front surface and the back surface, and determining the defect position to determine another defect position, where the position in the depth direction of the wafer is different, based on a displacement between the right-eye image and the left-eye image.
Claims8
1-5. (canceled)
A method for evaluating a defect position in a depth direction of a wafer using X-ray topography (XRT), the method comprising the steps of:
- irradiating a front surface of the wafer that has the front surface and a back surface with an X-ray from a right direction and a left direction at an incident angle satisfying diffraction conditions to obtain two XRT images, being a right-eye image and a left-eye image, on the back surface;
- position-adjusting to adjust the two obtained XRT images at the defect position on any one of the front surface and the back surface;
- and
- determining the defect position to determine another defect position, where the position in the depth direction of the wafer is different, based on a displacement between the right-eye image and the left-eye image.
A method for evaluating a defect position in a depth direction of a wafer using X-ray topography (XRT), wherein
- by irradiating a front surface of the wafer that has the front surface and a back surface with an X-ray from a right direction and a left direction at an incident angle satisfying diffraction conditions to obtain two XRT images, being a right-eye image and a left-eye image, on the back surface and then by visually capturing the two XRT images as a single image, the defect position in the depth direction is observed through stereoscopic viewing (3D image).
Dependencies are inferred from the claim text.