Package structure for optical sensor that enables sensing through reception of light in ultraviolet wavelength range and converts ultraviolet signal to digital signal and method for manufacturing the same

A method for manufacturing a package structure for an optical sensor that enables sensing through reception of light in an ultraviolet (UV) wavelength range and converts an UV signal to a digital signal, the method comprising:

• a dam forming step of forming, by a mold unit, a package dam portion at an edge of a printed circuit board (PCB) substrate on which a device portion for light sensing is mounted by a mold process, to form a placement space having an open side to place the device portion on the PCB substrate;
• a light shield forming step of mounting a mask unit on the package dam portion such that the mask unit covers the placement space, and feeding a light shielding material into the placement space through an inlet slit formed in the mask unit to form a light shield surrounding a side of the device portion;
• a coating step of separating the mask unit from the package dam portion, and feeding a light permeable material into the placement space to stack a light diffuser on the light receiving part of the device portion;
• and
• a filter mounting step of installing a filter unit at the package dam portion such that a filter portion is stacked on the light diffuser, to allow light of a specific wavelength to pass through and reduce an intensity of direct light incident on the light receiving part.