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US 2026/0168706 A1Published application
Cooling and hot compress device
AssigneeReestar International Limited
InventorChan Kiu
Life of this patent
Estimating the term…
Abstract
An example thermal device may include a housing having first and second protruding end portions and a recessed portion between them. The example thermal device may include a heat sink positioned within the recessed portion and occupies at least a majority of the recessed space. Moreover, the heat sink may include a top portion with a recessed region, a second portion thermally coupled to a thermoelectric cooling element, and at least one lateral side directly exposed to ambient air. In some examples, the heat sink may include a recessed region dimensioned to fit one or more fans.
Claims20
A thermal device, comprising:
- a housing having a first protruding end portion, a second protruding end portion, and a recessed portion between the first protruding end portion and the second protruding end portion;
- a heatsink positioned with in the recessed portion of the housing and occupies at least a majority of the recessed portion of the housing, the heatsink including:
- a top portion including a recessed portion,
- a second portion, and
- at least a first lateral side, wherein one or more portions of the first lateral side is in direct contact with ambient air,
- a fan positioned within the recessed portion of the heatsink;
- and
- a thermoelectric cooling element positioned within the recessed portion of the housing and thermally coupled to the second portion of the heatsink.
5 more elements
Dependencies are inferred from the claim text.