Electrolytic deposition system including hydrogels and methods of using same
AssigneeChemeon Surface Technology, LLC
InventorsAlexander Evan Westre, Sjon Westre, Danielle Walkiewicz
Life of this patent
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Abstract
A reactive electrochemical application system is provided. The reactive electrochemical application system includes a power supply configured to be electrically coupled to a substrate and a hydrogel electrically coupled to the power supply. The hydrogel includes a reactive chemical solution. The hydrogel is configured to contact the substrate, the power supply is configured to pass a current through the hydrogel and the substrate, and the reactive chemical solution is configured to treat the substrate when the current is passed through the hydrogel and the substrate.
Claims20
A reactive electrochemical application system comprising:
- a power supply configured to be electrically coupled to a substrate;
- and
- a hydrogel electrically coupled to the power supply, wherein the hydrogel comprises a reactive chemical solution;
- wherein the hydrogel is configured to contact the substrate, the power supply is configured to pass a current through the hydrogel and the substrate, and the reactive chemical solution is configured to treat the substrate when the current is passed through the hydrogel and the substrate.
A reactive electrochemical application system comprising:
- a power supply;
- a hydrogel comprising an electroplating reactive chemical solution;
- a first wire electrically coupled to the power supply and the hydrogel to define an anode;
- and
- a second wire electrically coupled to the power supply and configured to be electrically coupled to a substrate to define a cathode;
- wherein the hydrogel is configured to contact the substrate, the power supply is configured to pass a current through the hydrogel and the substrate, and the electroplating reactive chemical solution is configured to electroplate the substrate when the current is passed through the hydrogel and the substrate.
A reactive electrochemical application system comprising:
- a power supply;
- a hydrogel comprising an anodizing reactive chemical solution;
- a first wire electrically coupled to the power supply and the hydrogel to define a cathode;
- and
- a second wire electrically coupled to the power supply and configured to be electrically coupled to a substrate to define an anode;
- wherein the hydrogel is configured to contact the substrate, the power supply is configured to pass a current through the hydrogel and the substrate, and the anodizing reactive chemical solution is configured to anodize the substrate when the current is passed through the hydrogel and the substrate.
A reactive electrochemical application system comprising:
- a power supply;
- a hydrogel comprising a conversion coating reactive chemical solution;
- a first wire electrically coupled to the power supply and the hydrogel;
- and
- a second wire electrically coupled to the power supply and configured to be electrically coupled to a substrate;
- wherein the hydrogel is configured to contact the substrate, the power supply is configured to pass a current through the hydrogel and the substrate, and the conversion coating reactive chemical solution is configured to form a conversion coating on the substrate when the current is passed through the hydrogel and the substrate.
An electrolytic applicator comprising:
- a first liner;
- an electrode attached to the first liner;
- a hydrogel attached to the first liner and the electrode;
- and
- a second liner removably attached to the hydrogel;
- wherein the hydrogel comprises a reactive chemical solution.
A method of anodizing a substrate with a reactive electrochemical application system, the reactive electrochemical application system comprising a power supply, a hydrogel comprising an anodizing reactive chemical solution, a first wire electrically coupled to the power supply and the hydrogel to define a cathode, and a second wire electrically coupled to the power supply and configured to be electrically coupled to a substrate to define an anode, the method comprising:
- attaching the hydrogel to the substrate;
- electrically coupling the second wire to the substrate;
- and
- passing an electric current through the hydrogel and the substrate to anodize the substrate.
A method of electroplating a substrate with a reactive electrochemical application system, the reactive electrochemical application system comprising a power supply, a hydrogel comprising an electroplating reactive chemical solution, a first wire electrically coupled to the power supply and the hydrogel to define an anode, and a second wire electrically coupled to the power supply and configured to be electrically coupled to a substrate to define a cathode, the method comprising:
- attaching the hydrogel to the substrate;
- electrically coupling the second wire to the substrate;
- and
- passing an electric current through the hydrogel and the substrate to electroplate the substrate.
A method of forming a conversion coating on a substrate with a reactive electrochemical application system, the reactive electrochemical application system comprising a power supply, a hydrogel comprising a conversion coating reactive chemical solution, a first wire electrically coupled to the power supply and the hydrogel, and a second wire electrically coupled to the power supply and configured to be electrically coupled to a substrate, the method comprising:
- attaching the hydrogel to the substrate;
- electrically coupling the second wire to the substrate;
- and
- passing an electric current through the hydrogel and the substrate to form a conversion coating on the substrate.
Dependencies are inferred from the claim text.