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US 2026/0167902 A1Published application
Semiconductor substrate processing liquid
AssigneeKao Corporation
InventorKouhei YAMADA
Life of this patent
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Abstract
Provided is a treatment solution for a semiconductor substrate that has ahigh ability to remove organic matter on a substrate. An aspect of the present disclosure relates to a treatment solution for a semiconductor substrate. The treatment solution contains an aromatic solvent (component A) and an organic acid (component B). The component A contains aromatic ether.
Claims15
1-9. (canceled)
A removal method comprising:
- removing organic matter present on a substrate from the substrate by using a treatment solution,
- wherein the treatment solution comprises an aromatic solvent (component A) and an organic acid (component B),
- the component A contains aromatic ether (component A1), and
- the component A1 contains diphenyl ether.
1 more element
A treatment solution for a semiconductor substrate, comprising:
- an aromatic solvent (component A) and an organic acid (component B),
- wherein the component A contains aromatic ether (component A1), and
- the component A1 contains diphenyl ether.
A method for producing an electronic component, comprising:
- a cleaning process of cleaning a treating-target object by using a treatment solution,
- wherein the treatment solution comprises an aromatic solvent (component A) and an organic acid (component B),
- the component A contains aromatic ether (component A1), and
- the component A1 contains diphenyl ether.
1 more element
Dependencies are inferred from the claim text.