Uv adhesion-reducing adhesive for po protective film for wafer dicing and preparation method thereof
AssigneeXi'an Aerospace Sunvalor Chemical Co., Ltd.
InventorsYing LIANG, Pei WANG, Jianghua ZHU, Hanghang CHENG, Ping LI, Sheng CAO, Hao ZHANG
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Abstract
Provided are a UV adhesion-reducing adhesive for a polyolefin (PO) protective film for wafer dicing, and a preparation method thereof. The UV adhesion-reducing adhesive is prepared by raw materials including a component A and a component B, where the component A includes, in percentage by mass, 97-99.5% of an acrylate polymer, with a balance being a photoinitiator; the component B includes a curing agent; and the acrylate polymer is an acrylate polymer containing an unsaturated branched chain.
Claims18
A UV adhesion-reducing adhesive for a polyolefin (PO) protective film for wafer dicing, prepared by raw materials comprising a component A and a component B, wherein
- the component A comprises, in percentage by mass, 97-99.5% of an acrylate polymer, with a balance being a photoinitiator;
- the component B comprises a curing agent;
- and
- the acrylate polymer is an acrylate polymer containing an unsaturated branched chain.
Dependencies are inferred from the claim text.