Polyamide moulding compound and multi-layer structure

A polyamide moulding compound, wherein the polyamide moulding compound comprises the following components (A), (B) and (C), and optionally (D):

• (A) 40-85 wt. % of at least one semi-crystalline polyamide selected from the group consisting of homopolyamides PA46, PA66, PA610, PA612, PA1010, and
• PA1012 and copolyamides PA 66/6T and PA 66/6I/6T;
• (B) 8-35 wt. % of at least one amorphous polyamide based on aliphatic diamines with 6 to 24 carbon atoms and aliphatic and/or aromatic dicarboxylic acids with 8 to 12 C atoms, and optionally lactams and/or α,ω aminocarboxylic acids;
• (C) 7-20 wt. % of at least one polyolefin (C1) based on C2-C12 alkenes and/or at least one block copolymer (C2) based on vinylaromatic monomers and C2-C5 alkenes, or a mixture thereof, wherein said alkenes are branched or unbranched alkenes, and
• wherein polyolefin (C1) and/or vinylaromatic block copolymer (C2) contains or contain at least one additional monomer (M) selected from the group consisting of maleic anhydride, itaconic anhydride, glycidyl acrylate, glycidyl methacrylate, acrylic acid, methacrylic acid, vinyl acetate, C1-C12 alkyl acrylates, and C1-C12 alkyl methacrylates, and
• wherein these additional monomers (M) may be arranged in the polymer chain or grafted onto the polymer chain;
• 0-5 wt. % additives (D), differing from components (A) to (C),
• with the proviso that the sum of components (A)-(D) is 100 wt. %.