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US 2026/0167764 A1Published application
Epoxy compound product
AssigneeDaicel Corporation
InventorsMariko OKA, Hiroto TAKENAKA, Hirose SUZUKI
Life of this patent
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Abstract
Provided is a low-viscosity epoxy compound product that is not susceptible to curing shrinkage and can be used to form a cured product excelling in heat resistance and transparency. In the epoxy compound product according to the present disclosure, the purity of a compound represented by Formula (1) below is 90% or greater, and the total content proportion of a compound represented by Formula (a) below, a compound represented by Formula (b) below, a compound represented by Formula (c) below, and a compound represented by Formula (d) below is 10 mass % or less.
Claims9
An epoxy compound product, wherein
- a purity of a compound represented by Formula (1) is 90% or greater;
- and
- a total content proportion of a compound represented by Formula (a), a compound represented by Formula (b), a compound represented by Formula (c), and a compound represented by Formula (d) is 10 mass % or less,
Dependencies are inferred from the claim text.