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US 2026/0166898 A1Published application
Substrate alignment
AssigneeHewlett-Packard Development Company, L.P.
InventorsJosep Maria BEL CALAVIA, Ignasi BONJOCH ROMA, Andreu VINETS ALONSO
Life of this patent
Estimating the term…
Abstract
Example implementations provide a controller comprising circuitry to align a substrate; the controller comprising: circuitry to control varying the tension of an unspooled portion of the substrate between a spool bearing the substrate and a pinch roller; said circuitry comprising circuitry to control varying the pinch load exerted by the pinch roller on the unspooled portion of the substrate.
Claims10
Machine readable storage storing instructions arranged, when executed, to reduce substrate skew in a substrate advance mechanism, the instructions comprising:
- instructions to apply an alignment tension to a dispensed portion of the substrate that urges against a forward motion of the substrate through the advance mechanism, the instructions to apply the alignment tension comprising instructions to apply a predetermined pinch roller force to the substrate during the forward motion;
- said predetermined pinch roller force being less than a printing pinch roller force applied during printing, and
- instructions to control moving the substrate through the advance mechanism under the alignment tension and pinch roller force.
Dependencies are inferred from the claim text.