Very thin electronic packaging leather and preparation method thereof

A preparation method of very thin electronic packaging leather, the method comprises the following steps:

• S1:
• foundation fabric preparation:
• using terylene-elastane mixed dense plain woven butterfly mesh fabric as a foundation fabric layer, wherein terylene having a weight percentage of 75%-90% and elastane having a weight percentage of 10%-25%;
• S2:
• coating a surface layer sizing agent on a surface of a release paper, heating, drying, and obtaining a surface layer of the packaging leather;
• coating an intermediate layer sizing agent over the surface layer, heating, drying, and obtaining an intermediate layer of the packaging leather;
• S3:
• laminating the foundation fabric layer with the intermediate layer via an adhesive layer;
• applying an agent of the adhesive layer on the intermediate layer of the packaging leather, and attaching the foundation fabric layer before the agent is dried;
• S4:
• curing the foundation fabric layer and the release paper in a 135° C. drying oven for 10-20 min, taking out, releasing and obtaining a PU/very thin woven fabric laminated material packaging leather;
• S5:
• gravure printing antifouling coating on a surface of the PU/very thin woven fabric laminated material packaging leather, a coating amount is 20-30 g/m2, drying and curing at a temperature of 170° C.±10° C. to form an antifouling coating, and obtaining a very thin electronic packaging leather product.