Substrate processing method and substrate processing apparatus

A substrate processing apparatus, comprising:

• a holding part that holds a substrate horizontally and rotatably;
• a heating mechanism that heats the substrate that is held by the holding part;
• a first nozzle that supplies a first processing liquid to a peripheral part of a front surface of the substrate;
• a second nozzle that supplies a second processing liquid to the peripheral part of a back surface of the substrate;
• a moving mechanism that moves the first nozzle;
• and
• a controller, wherein
• the controller is configured to execute:
• a heating process that heats the substrate that is held by the holding part by using the heating mechanism;
• a temperature regulation process that discharges the second processing liquid from the second nozzle to the peripheral part of the substrate that rotates at a side of a back surface thereof, after the heating process and before the first processing liquid is discharged from the first nozzle that is arranged at a predetermined processing position to the peripheral part of a front surface of the substrate that rotates, in such a manner that an in-plane temperature distribution of the substrate approaches an in-plane temperature distribution in a case where the first processing liquid is discharged from the first nozzle that is arranged at the processing position to the peripheral part of a front surface of the substrate that rotates;
• and
• a first discharge process that discharges the first processing liquid from the first nozzle that is arranged at the processing position by using the moving mechanism to the peripheral part of a front surface of the substrate that rotates, after the temperature regulation process.