A source wafer and methods related thereto for micro-transfer printing
AssigneesUniversiteit Gent, Imec Vzw
InventorsStijn CUYVERS, Gunther ROELKENS, Kasper VAN GASSE, Bart KUYKEN
Life of this patent
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Abstract
A source wafer for micro-transfer printing, includes: a substrate; and on top of the substrate, a semiconductor film having a device coupon; and a micro-transfer printing pair formed at a periphery of the device coupon. The micro-transfer printing pair includes: a breakable tether securing the device coupon to the substrate. The breakable tether includes a breaking region; and at least one crack arrest pattern formed in the device coupon and extending at least partially through the device coupon.
Claims16
-15. (canceled)
A source wafer for micro-transfer printing, wherein said source wafer comprises:
- a substrate;
- and
- on top of said substrate, a semiconductor film comprising:
- a device coupon comprising a periphery corresponding to a boundary of said device coupon,
- wherein said periphery comprises a coupling portion;
- and
- a micro-transfer printing pair formed at said periphery of said device coupon,
- wherein said micro-transfer printing pair comprises:
- a breakable tether securing said device coupon to said substrate,
- wherein said breakable tether comprises a breaking region narrower than adjacent regions of said breakable tether along a parallel direction parallel to said periphery of said device coupon, said breaking region thereby having a lower shear strength than said adjacent regions;
- and
- wherein said breakable tether comprises a coupling segment coupling said coupling portion to said breaking region;
- and
- at least one crack arrest pattern formed in said device coupon and extending at least partially through said device coupon;
- wherein said coupling portion extends between said crack arrest pattern and said breaking region.
A method for forming a source wafer for micro-transfer printing, said method comprising the steps of:
- providing a substrate;
- on top of said substrate, providing a sacrificial layer;
- on top of said sacrificial layer, providing a semiconductor film;
- defining a designed device coupon on said semiconductor film;
- defining a designed micro-transfer printing pair at a periphery of said designed device coupon,
- wherein said designed micro-transfer printing pair comprises:
- a designed breakable tether comprising a designed breaking region;
- and
- a designed crack arrest pattern defined in said designed device coupon;
- etching:
- said sacrificial layer away at least partially between said designed device coupon and said substrate, thereby forming a device coupon suspended above said substrate and a cavity extending at least partially between said device coupon and said substrate and at least partially around said device coupon;
- said device coupon comprising a periphery corresponding to a boundary of said device coupon,
- wherein said periphery comprises a coupling portion;
- said sacrificial layer away at least partially between said designed breakable tether and said substrate, thereby forming a breakable tether comprising a breakable region narrower than adjacent regions of said breakable tether along a parallel direction parallel to said periphery of said device coupon, said breaking region thereby having a lower shear strength than said adjacent regions;
- wherein said breakable tether comprises a coupling segment coupling said coupling portion to said breaking region along said periphery;
- and
- wherein said breakable tether secures said device coupon to said substrate and bridges said cavity by said breakable tether;
- and
- said designed crack arrest pattern at least partially through said device coupon, thereby forming a crack arrest pattern with said coupling portion extending between said crack arrest pattern and said breaking region.
Dependencies are inferred from the claim text.