US 2026/0165034 A1Published application

Superconducting quantum chip preparation method and superconducting quantum chip

AssigneeYangtze Delta Industrial Innovation Center of Quantum Science and Technology

InventorsWeiwen ZHENG, Hui YANG, Yang REN, Zi LIU

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Abstract

The present application discloses a superconducting quantum chip preparation method and a superconducting quantum chip, and is applied to the technical field of quantum chips. The method includes the steps: arranging a separation layer on the surface of a first substrate; arranging an air bridge on the surface of the separation layer; the bridge surface of the air bridge is attached to the separation layer, and the bridge pier of the air bridge extends from the separation layer to the direction opposite to one side of the first substrate; electrically connecting the air bridge and the circuit device which are aligned with each other; after the air bridge and the circuit device are electrically connected with each other, separating the first substrate and the air bridge from each other through the separation layer, such that the superconducting quantum chip is manufactured.

Claims10

Dependent claims

A superconducting quantum chip preparation method, comprising:

arranging a separation layer on a surface of a first substrate;
arranging an air bridge on a surface of the separation layer;
a bridge surface of the air bridge is attached to the separation layer, and a bridge pier of the air bridge extends from the separation layer to the direction opposite to one side of the first substrate;
aligning the first substrate and the second substrate with each other;
one side of the first substrate facing the second substrate is provided with the air bridge, and one side of the second substrate facing the first substrate is provided with a circuit device;
electrically connecting the air bridge and the circuit device which are aligned with each other;
and
separating the first substrate and the air bridge from each other through the separation layer after the air bridge and the circuit device are electrically connected with each other, such that the superconducting quantum chip is manufactured.

5 more elements

Dependencies are inferred from the claim text.