Image sensor

An image sensor, comprising:

• a substrate including a photodiode;
• a first capacitor and a second capacitor provided on the substrate and spaced apart from each other in a first direction parallel to a top surface of the substrate;
• a first via extending lengthwise in a vertical direction and disposed between the first and second capacitors;
• a second via vertically overlapping with the first capacitor;
• and
• a third via vertically overlapping with the second capacitor,
• wherein the first capacitor comprises a first stack of electrodes and dielectric layers alternately stacked with the electrodes,
• the second capacitor comprises a second stack of electrodes and dielectric layers alternately stacked with the electrodes,
• the first via is electrically connected to a first electrode in the first capacitor and a third electrode in the second capacitor,
• the second via is electrically connected to a second electrode in the first capacitor that is not electrically connected to the first via, and
• the third via is electrically connected to a fourth electrode in the second capacitor that is not electrically connected to the first via.

An image sensor, comprising:

• a substrate comprising a photodiode and having a first surface and a second surface, which are opposite to each other in a vertical direction;
• a first capacitor and a second capacitor provided on the first surface of the substrate and spaced apart from each other in a first horizontal direction;
• a first via disposed between the first and second capacitors;
• a second via vertically overlapping with the first capacitor;
• and
• a third via vertically overlapping with the second capacitor,
• wherein the first capacitor comprises first and second electrodes, which are stacked on top of each other in the vertical direction, and a first dielectric layer, which is interposed between the first and second electrodes,
• the second capacitor comprises third and fourth electrodes, which are stacked on top of each other in the vertical direction, and a second dielectric layer interposed between the third and fourth electrodes,
• the first via is electrically connected to the first and the third electrodes,
• the second via is electrically connected to the second electrode,
• the third via is electrically connected to the fourth electrode, and
• the first and third electrodes constitute a first plate.