Micro-electro-mechanical systems transducer with deflection constraint

A Microelectromechanical Systems (MEMS) die for a microphone, the MEMS die comprising:

• a substrate;
• a perforated back plate mounted to the substrate and covering an aperture through the substrate;
• a diaphragm between the back plate and the substrate, the diaphragm comprising a central portion covering the aperture and an outer peripheral portion coupled to the substrate, the central portion of the diaphragm coupled to the outer peripheral portion of the diaphragm by a plurality of springs located outwardly of the aperture;
• a post protruding from the back plate and configured to contact the central portion of the diaphragm when the diaphragm is biased toward the back plate;
• and
• a plurality of deflection limiters protruding from the back plate and spaced apart from the diaphragm when the diaphragm is biased toward the back plate and when the MEMS die is not subject to excessive acoustic energy,
• wherein deflection of the diaphragm toward the back plate is limited by contact with the plurality of deflection limiters when the MEMS die is subject to excessive acoustic energy.

A Microelectromechanical Systems (MEMS) die for a microphone, the MEMS die comprising:

• a substrate;
• a perforated back plate mounted to the substrate and covering an aperture through the substrate;
• a diaphragm between the back plate and the substrate, the diaphragm comprising a central portion covering the aperture and an outer peripheral portion coupled to the substrate, the central portion of the diaphragm coupled to the outer peripheral portion of the diaphragm by a plurality of springs located outwardly of the aperture;
• a post protruding from the back plate and configured to contact the central portion of the diaphragm when the diaphragm is biased toward the back plate;
• a plurality of deflection limiters protruding from the back plate and configured to contact the diaphragm when the diaphragm is biased toward the back plate;
• and
• overpressure stops protruding from the back plate and located inwardly of the plurality of deflection limiters,
• wherein deflection of the central portion of the diaphragm toward the back plate is limited by contact with the overpressure stops when the MEMS die is subject to excessive acoustic energy.