Semiconductor device and method of manufacturing the same

Abstract

To provide a semiconductor device and its manufacturing method capable of designing the intended delay with high precision using fewer steps. The manufacturing method of the semiconductor device disclosed herein arranges multiple circuits on a plane and connects wiring to each, comprising: a placement step of arranging a digital circuit that operates based on timing signals and a delay circuit configured with multiple delay paths having different input/output delay amounts, where one of the multiple delay paths can be selected by a selection signal; a wiring step of connecting the output of the delay circuit so that it becomes the timing signal of the digital circuit; and a delay adjustment step of selecting one of the multiple delay paths by connecting a predetermined voltage as the selection signal, and selecting the delay amount so that the input/output timing of the digital circuit meets predetermined conditions.

Dependencies are inferred from the claim text.