Method of forming electrical component with improved sealing

A method of forming a component lead wire comprising the steps of:

• crimping a first lead wire from an electrical component at a first crimp to a component lead wire to be connected to a component;
• crimping a second lead wire from the electrical component to a power lead line to be connected with a source of power at a second crimp;
• positioning a protective material outwardly of the electrical component, and heat staking the protective material to one of the component and first lead lines at a location spaced from the electrical component and also heat staking one of the power and second lead lines at a location spaced from the electrical component;
• the heat staking being performed by a tool for heat staking a tubing about a wire comprising:
• and
• a tool body having a RF heat applying section with lateral sides with a generally planar surface and a heat applying portion formed about a cylindrical surface, and the cylindrical surface being designed to be between 105 and 115 percent of a radius of a wire which is to be heat staked to a tubing.