Apparatus for testing an electronic device

An apparatus for testing an electronic device, wherein the electronic device comprises a substrate having a set of conductive pads formed on its back surface, and a semiconductor component mounted on a front surface of the substrate and exposed to an external space;

• and
• wherein the apparatus comprises:
• a test board;
• a test socket disposed on the test board, wherein the test socket comprises:
• a socket body having a socket base for placing the electronic device and a side wall surrounding the socket base, wherein the side wall has an inner surface inclined relative to the socket base and defining a cavity with an inverted trapezoidal section;
• and
• contact pins vertically extending through the socket base and movable vertically relative to the socket base, wherein the contact pins are electrically connectable with the set of conductive pads of the electronic device respectively when the electronic device is placed on the socket base;
• and
• a device socket lid removably mounted on the test socket, wherein the device socket lid comprises:
• a top cover portion operably supported on the side wall of the socket body;
• a pusher portion extending downward from the top cover portion, and having a bottom surface and a lateral surface mating with the inner surface of the side wall of the socket body and having a trapezoidal section, such that the pusher portion is substantially accommodated within the cavity of the socket body with the bottom surface aligned with the socket base, when the device socket lid is mounted on the test socket;
• and
• press pins extending from the bottom surface of the pusher portion of the device socket lid, wherein the press pins are configured to press the substrate of the electronic device downward against the test board through the contact pins of the test socket to set up an electrical connection between the electronic device and the test board, when the device socket lid is mounted on the test socket.