Injector apparatus, semiconductor processing systems including injector apparatus, and methods of depositing material layers onto workpieces using semiconductor processing systems and injector apparatus

An injector holder, comprising:

• an injector collar having a first injector collar end and a second injector collar end;
• an injector rim coupled to the first injector collar end of the injector collar and defining an injection aperture;
• and
• an injector protrusion extending from the injector rim about the injection aperture.

A reactor flange, comprising:

• a tube member having a first tube member end and a second tube member end;
• a reactor rim coupled to the first tube member end of the tube member and defining a reactor aperture;
• and
• a reactor protrusion extending from the reactor rim about the reactor aperture.

A method of depositing a material layer onto a workpiece, comprising:

• at a semiconductor processing system including the workpiece arranged within an interior of a chamber body and an injector apparatus including an injector holder having an injector protrusion;
• a reactor flange have a reactor protrusion;
• a coupling member;
• and a connector body configured to mechanically couple the injector holder, the coupling member, and the reactor flange, the connector body configured to compress the coupling member between the injector holder and the reactor flange;
• seating the workpiece within the interior of the chamber body;
• heating the workpiece to a predetermined material layer deposition temperature;
• exposing the workpiece to a material layer precursor;
• and
• depositing the material layer onto the workpiece using the material layer precursor.