Resin composition, resin film, and display device
AssigneeSumitomo Chemical Company, Limited
InventorsMasayoshi TOKUDA, Yoshifumi KOMATSU, Mitsuo TSUCHIYA, Yukako NISHIKAWA
Life of this patent
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Abstract
Provided are a resin composition comprising a semiconductor particle (A) and a resin (B), wherein a content of a polymerizable compound (C) and a content of a polymerization initiator (D) are each 0.01% by mass or less based on a total amount of a solid content of the resin composition, and a ratio of the content of the semiconductor particle (A) to that of the resin (B) is 0.60 or more in terms of mass ratio; a resin film formed from the resin composition; and a display device comprising the resin film.
Claims8
A resin composition comprising a semiconductor particle (A) and a resin (B),
- wherein a content of a polymerizable compound (C) and a content of a polymerization initiator (D) are each 0.01% by mass or less based on a total amount of a solid content of the resin composition, and
- a ratio of a content of the semiconductor particle (A) to that of the resin (B) is 0.60 or more in terms of mass ratio.
Dependencies are inferred from the claim text.