Resin composition, and prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board using same

A resin composition comprising:

• a polyphenylene ether compound (A) having a carbon-carbon unsaturated double bond in a molecule;
• a polyfunctional vinyl aromatic copolymer (B) containing a repeating unit (b1) derived from a divinyl aromatic compound and a repeating unit (b2) derived from a monovinyl aromatic compound;
• and
• a nitrogen-containing compound (C) having at least one among structural units represented by the following formulas (1-1), (1-2), and (1-3):
• in the formulas (1-1) to (1-3), R1 is independently at each occurrence a halogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 20 carbon atoms, a nitro group, a cyano group, a primary to tertiary amino group, or a salt of a primary to tertiary amino group;
• n is independently at each occurrence an integer of 0 to 2;
• when n is 2, a plurality of R1s may be the same or different and may be bonded in any combination to form a part of a ring structure.