Element substrate, printing head, and printing apparatus

An element substrate having a laminate structure, comprising, from bottom in a laminated direction of the element substrate:

• a substrate of a semiconductor material;
• a plurality of first MOS transistors and a plurality of second MOS transistors disposed on the substrate of the semiconductor material;
• an insulation layer disposed on the substrate of the semiconductor material and the plurality of first MOS transistors and the plurality of second MOS transistors;
• and
• a plurality of first energy generation elements disposed on the insulation layer and configured to be driven by the plurality of first MOS transistors to generate heat to eject a liquid;
• and
• a plurality of second energy generation elements configured to be driven by the plurality of second MOS transistors to generate heat to flow the liquid,
• wherein each first energy generation element and each second energy generation element and at least one of the plurality of first MOS transistors or at least one of the plurality of second MOS transistors are arranged at positions to partially overlap each other in planar view,
• wherein a heat transfer line formed of a material with higher thermal conductivity than that of a material of the insulation layer is arranged in the insulation layer, and
• wherein the heat transfer line is arranged at a position in which at least one of each first energy generation element and each second energy generation element and a part of the heat transfer line overlap each other in planar view, and is connected to the substrate of the semiconductor material.