Laser processing machine and laser processing method
AssigneeDisco Corporation
InventorsJunichi Kuki, Kunimitsu Takahashi
Life of this patent
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Abstract
A laser processing machine for processing a workpiece is provided. This laser processing machine includes a holding mechanism configured to hold the workpiece, an irradiation unit configured to apply a laser beam to the workpiece held on the holding mechanism, an ejection unit configured to eject rinse liquid against the workpiece held on the holding mechanism, a recovery unit configured to recover the rinse liquid ejected against a front surface of the workpiece held on the holding mechanism, and a moving mechanism configured to move the irradiation unit and the holding mechanism relative to each other.
Claims6
A laser processing machine for processing a workpiece, comprising:
- a holding mechanism configured to hold the workpiece;
- an irradiation unit configured to apply a laser beam to the workpiece held on the holding mechanism;
- an ejection unit configured to eject rinse liquid against the workpiece held on the holding mechanism;
- a recovery unit configured to recover the rinse liquid ejected against a front surface of the workpiece held on the holding mechanism;
- and
- a moving mechanism configured to move the irradiation unit and the holding mechanism relative to each other.
A laser processing method for processing a workpiece, comprising:
- holding the workpiece on a holding mechanism configured to hold the workpiece,
- applying a laser beam to the workpiece held on the holding mechanism,
- ejecting rinse liquid against a front surface of the workpiece held on the holding mechanism, and
- recovering the rinse liquid ejected against the front surface of the workpiece while the rinse liquid is ejected against the front surface of the workpiece held on the holding mechanism.
Dependencies are inferred from the claim text.