Method for manufacturing ceramic electronic component

Abstract

A method for manufacturing a ceramic electronic component that includes: forming a modeled object by applying a ceramic material, a metal material, and a disappearing material by 3D printing, the modeled object including an electronic component main body containing the ceramic material and the metal material, a support body that contains the ceramic material and that is disposed around at least a portion of a periphery of the electronic component main body, and a disappearing body that contains the disappearing material and that is disposed between the electronic component main body and the support body; firing the modeled object at a temperature higher than or equal to a temperature at which the disappearing body disappears; and isolating the support body from the modeled object after firing so as to obtain the ceramic electronic component.

Dependencies are inferred from the claim text.