Printed circuit board

A printed circuit board comprising:

• a first substrate portion including a pad including a first metal, the pad being disposed in a first portion of the first substrate portion;
• a second substrate portion disposed on the first substrate portion;
• a bridge at least partially disposed within the second substrate portion, and including a bridge pad including a second metal, the bridge pad being disposed in a first portion of the bridge;
• and
• a conductive connection portion disposed between the pad and the bridge pad,
• wherein the conductive connection portion includes a first conductive layer including a third metal, a second conductive layer including the first metal and the third metal, and a third conductive layer including the second metal and the third metal, and
• wherein the first conductive layer is disposed between the second conductive layer and the third conductive layer.