Method for manufacturing a roll carrier for electronic components

Reel-to-reel process for manufacturing a carrier for electronic components, comprising

• a step during which a reel of a strip of substrate is unrolled, this substrate having two faces at least one of which is adhesive, and
• a step during which at least one singulated electronic component is transferred to the substrate, this electronic component having a rear main face, a front main face, at least one zone called the bonding zone, and at least one zone called the connecting zone in which an electrical contact configured to electrically connect the electronic component is placed,
• wherein the step of transferring the electronic component to the substrate comprises bringing said bonding zone of the electronic component into contact with the adhesive face of the substrate, said bonding zone being distinct from said connecting zone,
• this process being characterized in that, at the end of this transferring step, a fastening zone is left free, on the same side of the substrate as its adhesive face, this fastening zone being configured to subsequently receive a layer for fastening the electronic component to a chip card.