Photosensitive resin composition, cured product, and semiconductor element
OwnerFumihiko KAWAUCHI, Guillermo FERNANDEZ ZAPICO +1inventors
InventorsFumihiko KAWAUCHI, Guillermo FERNANDEZ ZAPICO, Tatsuya MAKINO
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Abstract
A photosensitive resin composition according to the present disclosure contains a maleimide compound; a crosslinking agent; and a photopolymerization initiator, in which the maleimide compound is a reaction product of a tetracarboxylic dianhydride (a1), an amine (a2), and maleic anhydride (a3), the amine (a2) includes a dimer diamine and a second amine other than the dimer diamine, and at least one of the tetracarboxylic dianhydride (a1) and the amine (a2) includes a compound having a fluorene skeleton.
Claims11
A photosensitive resin composition comprising:
- a maleimide compound;
- a crosslinking agent;
- and a photopolymerization initiator,
- wherein the maleimide compound is a reaction product of a tetracarboxylic dianhydride (a1), an amine (a2), and maleic anhydride (a3),
- the amine (a2) includes a dimer diamine and a second amine other than the dimer diamine, and
- at least one of the tetracarboxylic dianhydride (a1) and the amine (a2) includes a compound having a fluorene skeleton.
Dependencies are inferred from the claim text.