Method of forming patterns

Abstract

A method of forming or providing patterns is disclosed. The method of forming or providing patterns may include: forming or providing an etching target film on a substrate; coating a semiconductor photoresist composition including an organometallic compound and a solvent on the etching target film to form or provide a photoresist film; exposing the photoresist film utilizing a patterned mask; dry developing the photoresist film utilizing gas to form or provide a photoresist pattern; and etching the etching target film utilizing the photoresist pattern as an etching mask.

Dependencies are inferred from the claim text.