Resist compound for photolithography and method for manufacturing semiconductor device using the same

A method for manufacturing a semiconductor device, the method comprising forming a photoresist film on a substrate,

• wherein the photoresist film includes a resist compound containing an organic molecule,
• the organic molecule includes a core structure containing at least six benzene rings and a functional group bonded to at least one of the benzene rings, and
• the functional group is represented by Formula 1 or Formula 2:
• wherein in Formulas 1 and 2 above,
• * is a portion bonded to a carbon of the at least one of the benzene rings,
• L1 and L2 are each independently an alkylene group having 1 to 10 carbon atoms, or oxygen,
• X is an alkylene group having 1 to 10 carbon atoms in which at least one hydrogen is substituted with a hydroxyl group (—OH),
• R1 is an unsaturated hydrocarbon group having 2 to 10 carbon atoms with at least one C═C bond or at least one C≡C bond, or an unsaturated hydrocarbon group having 2 to 10 carbon atoms with at least one C═C bond and with at least one hydrogen substituted with a substituent represented by Formula 3:
• wherein in Formula 3 above, * is a portion bonded to a carbon of R1, M is a metal, R2 is an aryl group having 6 to 30 carbon atoms, and n is an integer of 1 to 3.