Polishing apparatus and method of polishing workpiece

Abstract

A polishing apparatus includes: a chuck table which holds a workpiece, a polishing mechanism to which a polishing tool configured to polish the workpiece is attached and which is configured to rotate the polishing tool, an elevation mechanism which is configured to move up and down the chuck table and the polishing tool relative to each other in a vertical direction; and a horizontal movement mechanism which is configured to move the chuck table and the polishing tool relative to each other in a horizontal direction, the polishing tool being a polishing roll that has an outer side surface used for polishing the workpiece, and the polishing mechanism including a spindle unit to which the polishing roll is attached and which rotates about a rotational axis whose longitudinal direction is the horizontal direction so as to rotate the polishing roll about the rotational axis.

Dependencies are inferred from the claim text.