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US 2026/0150701 A1Published application
Semiconductor wafer, method for manufacturing semiconductor wafer, semiconductor chip, and method for manufacturing semiconductor chip
AssigneeMitsubishi Electric Corporation
InventorsTakuma MATSUMOTO, Takuyo NAKAMURA, Kenichi HAMANO, Kyohei AKIYOSHI
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Abstract
According to the present disclosure, a semiconductor wafer includes a semiconductor substrate, an epitaxial growth layer provided on an upper surface of the semiconductor substrate; and an identification part that is not exposed from the upper surface and a lower surface of the semiconductor substrate and is provided inside the semiconductor substrate, and is capable of identifying the semiconductor wafer.
Claims17
A semiconductor wafer comprising:
- a semiconductor substrate;
- an epitaxial growth layer provided on an upper surface of the semiconductor substrate;
- and
- an identification part that is not exposed from the upper surface and a lower surface of the semiconductor substrate and is provided inside the semiconductor substrate, and is capable of identifying the semiconductor wafer.
1 more element
A semiconductor chip comprising:
- a semiconductor substrate;
- an epitaxial growth layer provided on an upper surface of the semiconductor substrate;
- an opaque layer provided on the epitaxial growth layer;
- and
- an identification part that is not exposed from the upper surface and a lower surface of the semiconductor substrate and is provided inside the semiconductor substrate, and is capable of identifying the semiconductor chip.
2 more elements
A method for manufacturing a semiconductor wafer, the method comprising:
- preparing a semiconductor substrate;
- forming an identification part inside the semiconductor substrate, the identification part being not exposed from a upper surface and a lower surface of the semiconductor substrate and capable of identifying the semiconductor wafer;
- and
- after the forming of the identification part, forming an epitaxial growth layer on the upper surface of the semiconductor substrate.
1 more element
Dependencies are inferred from the claim text.