Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsTomoaki INOKUCHI, Shotaro BABA, Hiroki NEMOTO, Hiro GANGI, Taichi FUKUDA, Yusuke KOBAYASHI
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AssigneeKabushiki Kaisha Toshiba
InventorsTomoaki INOKUCHI, Shotaro BABA, Hiroki NEMOTO, Hiro GANGI, Taichi FUKUDA, Yusuke KOBAYASHI
Estimating the term…
According to one embodiment, a semiconductor device includes first to third electrodes, a semiconductor member, and a first insulating member. The second electrode includes a first electrode portion and a second electrode portion. A direction from the first electrode to the first electrode portion is along a first direction. The second electrode portion is electrically connected to the first electrode portion. The semiconductor member includes a first semiconductor region of a first conductivity type. The first semiconductor region includes first to third partial regions. The first semiconductor region includes at least one of a fourth partial region or a fifth partial region. At least a part of the fourth partial region is between the third electrode and the first electrode portion in the first direction. At least a part of the fifth partial region is between the second electrode portion and the first electrode portion in the first direction.
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.