Semiconductor power device with shielding layer
AssigneeHuawei Digital Power Technologies Co., Ltd.
InventorGilberto Curatola
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AssigneeHuawei Digital Power Technologies Co., Ltd.
InventorGilberto Curatola
Estimating the term…
The disclosure relates to a semiconductor power device (100), comprising: a semiconductor substrate (110); a transition layer (111) formed above the semiconductor substrate (110); a Gallium-Nitride, GaN, channel layer (122) formed above the transition layer (111); an Aluminum Gallium-Nitride, AlGaN, barrier layer (130) formed on top of the GaN channel layer (122); a first GaN power device (102) and a second GaN power device (103) formed next to each other in the AlGaN barrier layer (130) and the GaN channel layer (122); and a shielding layer (101) formed between the GaN channel layer (122) and the semiconductor substrate (110). The shielding layer (101) is configured to create a 2-dimensional hole gas, 2DHG, for shielding the first GaN power device (102) and the second GaN power device (103) against an electrical potential of the semiconductor substrate (110).
A semiconductor power device (100), comprising:
A method (600) for producing a semiconductor power device (100), the method comprising:
Dependencies are inferred from the claim text.