Electrical component thermal management assembly for space applications

An assembly for providing heat conduction for an electrical component of a spacecraft, the assembly comprising:

• a first thermal interface material (TIM) disposed on the electrical component;
• a heat sink having a first side and a second side, the heat sink being disposed on the first TIM at the heat sink first side and opposite the electrical component, the first TIM being in thermal contact with the electrical component and the heat sink;
• a cover disposed on the heat sink second side, the cover defining a plurality of cooling fins having a cooling fin pattern, the heat sink including a plurality of cooling fin recesses, the plurality of cooling fin recesses defining a cooling fin recess pattern that is complementary to the cooling fin pattern;
• and
• a second TIM disposed within the plurality of cooling fin recesses and being in contact with the heat sink and the cover via the plurality of cooling fins and the plurality of cooling fin recesses.

An assembly for providing heat conduction for an electrical component of a spacecraft, the assembly comprising:

• a heat sink having a first side and a second side, the heat sink being disposed on the electrical component at the heat sink first side;
• a cover disposed on the heat sink second side, the cover defining a plurality of cooling fins having a cooling fin pattern, the heat sink including a plurality of cooling fin recesses, the plurality of cooling fin recesses defining a cooling fin recess pattern that is complementary to the cooling fin pattern;
• and
• a heat sink thermal interface material (TIM) disposed within the plurality of cooling fin recesses and being in contact with the heat sink and the cover via the plurality of cooling fins and the plurality of cooling fin recesses.