Galvanically isolated communication links using coils fabricated in molding compound
AssigneeNXP USA, Inc.
InventorsAnkur Shailesh Shah, Michael B. Vincent, Zhiwei Gong
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Abstract
A packaged device includes molding compound, a first semiconductor die disposed within the molding compound and a second semiconductor die disposed within the molding compound. The molding compound galvanically isolates the first and second semiconductor dies. The packaged device further includes communication coils constructed and arranged to provide communication between the first and second semiconductor dies through inductive coupling, at least one of the communication coils being fabricated within the molding compound.
Claims20
A packaged device, comprising:
- molding compound;
- a first semiconductor die disposed within the molding compound;
- a second semiconductor die disposed within the molding compound, the molding compound galvanically isolating the first and second semiconductor dies;
- and
- communication coils constructed and arranged to provide communication between the first and second semiconductor dies through inductive coupling, at least one of the communication coils being fabricated within the molding compound.
A method of providing a packaged device, the method comprising:
- providing molding compound around a first semiconductor die and a second semiconductor die, the molding compound galvanically isolating the first and second semiconductor dies;
- and
- fabricating at least one communication coil within the molding compound to enable communication between the first and second semiconductor dies through inductive coupling.
Dependencies are inferred from the claim text.