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US 2026/0148031 A1Published application
Microwave-safe inlay
Assigneeetifix GmbH
InventorMartin BOHN
Life of this patent
Estimating the term…
Abstract
A microwave-safe inlay includes an RFID chip, an antenna, and a substrate having special shielding surfaces. These shielding surfaces are arranged in such a manner that they block microwave radiation, while communication in the HF/NFC and UHF range continues to be possible. The inlay is thin, mechanically and thermally durable, and can be used with or without shielding elements to be additionally placed under it. It is particularly intended for use with and integration into reusable microwavable dishes, so as to allow reliable identification and writing and/or reading of additional information, as well.
Claims15
1:
- A microwave-safe inlay, comprising an RFID chip (2), an antenna (3) connected with the chip electrically or magnetically, and a first substrate (4) arranged surface-parallel, having a plurality of discrete shielding surfaces (5), wherein the RFID chip (2), with the antenna (3), is applied to the first substrate (4), and two adjacent shielding surfaces (5) have an interstice between them, in each instance,
- wherein the shielding surfaces (5) are arranged as separate elements, spaced apart from one another, on the first substrate (4), in at least one pattern layer, in which the interstices between the adjacent shielding surfaces (5) are oriented relative to one another so as not to align, in such a manner that they block every straight-line path through the shielding surfaces (5) that runs exclusively along the interstices.
2:
- The inlay according to claim 1, wherein the RFID chip (2), together with the antenna (3), is applied directly to the first substrate (4), on its side that faces away from the shielding surfaces (5).
3:
- The inlay according to claim 1, wherein the RFID chip (2), together with the antenna (3), is applied to a second substrate (8), and the latter is applied, preferably glued, to the first substrate (4), on its side that lies opposite the shielding surfaces.
4:
- The inlay according to claim 3, wherein the antenna (3) is applied to the second substrate on both sides, and the shielding surfaces (5) are applied to the first substrate (4) on its side that faces away from the RFID chip (2) and the antenna (3).
5:
- The inlay according to claim 1, wherein the RFID chip (2), together with the antenna (3), is applied to a second substrate (8), and the second substrate (8) is applied, preferably glued, to the first substrate (4), wherein two pattern layers are assigned, either to the first substrate (4) on both sides or to the first substrate (4) on one side and to a third substrate on one side, wherein the third substrate is applied to the first substrate (4) on the side that lies opposite the second substrate (8).
6:
- The inlay according to claim 5, wherein the shielding surfaces are arranged in the pattern layers in such a manner that the pattern layers are offset from one another in at least one surface direction.
7:
- The inlay according to claim 6, wherein the shielding surfaces of the pattern layers overlap one another without gaps.
8:
- The inlay according to claim 1, wherein the shielding surfaces (5) are configured to be circular, oval or as a regular polygon, in particular a hexagon, so that each shielding surface (5) is surrounded by six adjacent shielding surfaces (5) in offset rows (6).
9:
- The inlay according to claim 8, wherein the shielding surfaces (5), along a row (6), take up a distance from center point to center point that is greater than the diameter of the individual shielding surfaces (5), while the distance of a row (6) from an adjacent row (6) is smaller than the diameter of the individual shielding surfaces (5).
10:
- The inlay according to claim 1, wherein the shielding surfaces (5) comprise freely shaped contours.
11:
- The inlay according to claim 1, wherein the shielding surfaces (5), which are composed of copper or aluminum, preferably of 8 to 10 μm thick aluminum, are applied using the etching method or by being punched out and glued onto the first substrate (4).
12:
- The inlay according to claim 1, wherein the shielding surfaces (5) or the antenna (3) or the shielding surfaces (5) and the antenna (3) are printed using a conductive ink.
13:
- The inlay according to claim 1, wherein an adhesive layer (10) is assigned to the first substrate (4), wherein the adhesive layer is set up for being affixed to a substrate, preferably to a part of a microwavable dish.
14:
- The inlay according to claim 1, which is worked into the bottom or the wall of a microwave-safe container or dish part made of plastic, glass or porcelain, with shape fit, visibly or invisibly.
15:
- The inlay according to claim 1, wherein a read/write memory is assigned to the RFID chip, to which memory control commands for controlling a microwave oven are assigned.