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AssigneeInternational Business Machines Corporation
InventorsJohn Knickerbocker, Akihiro Horibe, Hsianghan Hsu, Neng Liu, Adrian Paz Ramos, Jean Benoit Heroux, Qianwen Chen, Sayuri Hada, CHINAMI ISHIKAWA, Yoichi Taira
Estimating the term…
Co-packaged optical modules having high bandwidth density, low insertion loss, and solder reflow and reliability stress compatibility are provided. In one aspect, an optical module includes: a photonic integrated circuit attached to a substrate; a lid in direct contact with the substrate such that the photonic integrated circuit is present in between the substrate and the lid; optical waveguides attached to the photonic integrated circuit; and a ferrule attached to the optical waveguides. The lid can be present over the photonic integrated circuit, and directly contacts a top of the substrate. Conversely, the lid can be present below the photonic integrated circuit, and directly contacts a bottom of the substrate.
An optical module, comprising:
An optical module, comprising:
An optical module, comprising:
Dependencies are inferred from the claim text.