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US 2026/0146798 A1Published application
Heat dissipation substrate and heat dissipation device
AssigneeKYOCERA Corporation
InventorsTakashi MIYAMOTO, Kazuki NISHIMTO
Life of this patent
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Abstract
A heat dissipation substrate includes a base body, a cover member, and a pipe mounting portion. The base body contains a carbon material. The cover member is located on an outer surface of the base body. The pipe mounting portion is a groove or a through hole positioned so as to extend across the base body and the cover member.
Claims15
A heat dissipation substrate comprising:
- a base body containing a carbon material;
- a cover member located on an outer surface of the base body;
- and
- a pipe mounting portion positioned so as to extend across the base body and the cover member, the pipe mounting portion being a groove or a through hole.
1 more element
Dependencies are inferred from the claim text.