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US 2026/0146312 A1Published application
High resolution shadow mask gasket
AssigneeBAE Systems Information and Electronic Systems Integration Inc.
InventorsAlexander S. Warren, Nathaniel P. Wyckoff, Benjamin Terry
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Abstract
A system, assembly and method of producing an integrated circuit is provided. A shadow mask is adhered to and aligned with a substrate. There is a shadow mask gasket interposed between the shadow mask and the substrate. A thin film material is deposited on the substrate, such as a silicon wafer, through the shadow mask and the shadow mask gasket. The thin film material that is deposited results in a thin film feature having a boundary with a vertical edge.
Claims20
A method of producing an integrated circuit comprising:
- aligning a shadow mask with a substrate, wherein the shadow mask defines at least one aperture extending therethrough;
- providing a shadow mask gasket between the shadow mask and the substrate, wherein when the shadow mask gasket is interposed between the shadow mask and the substrate, at least one opening defined by the shadow mask gasket is aligned with the aperture in the shadow mask;
- depositing a thin film material through the aperture and the opening onto the substrate;
- and
- forming at least one thin film feature on the substrate, wherein the at least one thin film feature includes at least a first side edge.
2 more elements
An assembly, comprising:
- a shadow mask configured to align with a substrate, wherein the shadow mask defines a first aperture;
- a shadow mask gasket defining a first opening, wherein the shadow mask gasket is configured to be interposed between the shadow mask and the substrate;
- wherein the shadow mask gasket is coupled to, and aligned with, the shadow mask such that the shadow mask gasket surrounds a periphery of the first aperture;
- wherein the shadow mask gasket is configured to be coupled to the substrate;
- wherein the first opening is configured to align with the first aperture;
- and
- wherein when a thin film material is deposited on the substrate through the first aperture of the shadow mask and through the first opening of the shadow mask gasket in an area located on the substrate a thin film feature comprises substantially vertical side edges.
4 more elements
Dependencies are inferred from the claim text.