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US 2026/0146309 A1Published application
Tungsten wire, and tungsten wire processing method and electrolytic wire using the same
AssigneeNiterra Materials Co., Ltd.
InventorsHitoshi AOYAMA, Hideaki BABA, Masanori MIZOBE, Kenji TOMOKIYO
Life of this patent
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Abstract
According to one embodiment, a tungsten wire includes a tungsten alloy containing rhenium. The tungsten wire includes a protrusion peak density (Spd) of 7000 or more and 11000 or less as a surface roughness parameter.
Claims20
A method for manufacturing a probe pin, the method comprising:
- drawing a tungsten wire comprising a tungsten alloy containing rhenium in an amount of from 1 wt % to 30 wt %, the tungsten wire comprising a protrusion peak density (Spd) of from 7000 to 11000 as a surface roughness parameter;
- cutting the tungsten wire;
- and
- polishing a surface of the tungsten wire.
1 more element
A method for manufacturing a thermocouple wire, the method comprising
- drawing a tungsten wire comprising a tungsten alloy containing rhenium in an amount of from 1 wt % to 30 wt % and potassium in an amount of from 30 wtppm to 90 wtppm, the tungsten wire comprising a protrusion peak density (Spd) of from 7000 to 11000 as a surface roughness parameter.
A method for manufacturing an electronic tube heater wire, the method comprising
- drawing a tungsten wire comprising a tungsten alloy containing rhenium in an amount of from 1 wt % to 30 wt % and potassium in an amount of from 30 wtppm to 90 wtppm, the tungsten wire comprising a protrusion peak density (Spd) of from 7000 to 11000 as a surface roughness parameter.
Dependencies are inferred from the claim text.