Epoxy adhesive composition and epoxy adhesive structure
AssigneesHyundai Motor Company, Kia Corporation
InventorsSung Chul Shin, Jae Cheol Jeon
Life of this patent
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Abstract
In an embodiment an epoxy adhesive composition is disclosed. The epoxy adhesive composition includes a bisphenol-based epoxy resin, a rubber-modified epoxy resin, a hardener, a flow regulator, and a storage stabilizer, wherein the epoxy adhesive composition includes 41 wt % to 49 wt % of the rubber-modified epoxy resin, 11 wt % to 20 wt % of the flow regulator, and 0.5 wt % to 1.4 wt % of the storage stabilizer based on a total of 100 wt % of the composition.
Claims20
An epoxy adhesive composition comprising:
- a bisphenol-based epoxy resin;
- a rubber-modified epoxy resin;
- a hardner;
- a flow regulator;
- and
- a storage stabilizer,
- wherein the epoxy adhesive composition comprises 41 wt % to 49 wt % of the rubber-modified epoxy resin, 11 wt % to 20 wt % of the flow regulator, and 0.5 wt % to 1.4 wt % of the storage stabilizer based on a total of 100 wt % of the composition.
A method for preparing an epoxy adhesive composition, the method comprising:
- mixing a bisphenol-based epoxy resin, a rubber-modified epoxy resin, a hardner, a flow regulator, and a storage stabilizer,
- wherein mixing provides the epoxy adhesive composition comprising 41 wt % to 49 wt % of the rubber-modified epoxy resin, 11 wt % to 20 wt % of the flow regulator, and 0.5 wt % to 1.4 wt % of the storage stabilizer based on a total of 100 wt % of the composition.
A method comprising:
- applying an epoxy adhesive composition between an automotive structure and a member, wherein the epoxy adhesive composition comprises a bisphenol-based epoxy resin, a rubber-modified epoxy resin, a hardener, a flow regulator and a storage stabilizer, and wherein the epoxy adhesive composition comprises 41 wt % to 49 wt % of the rubber-modified epoxy resin, 11 wt % to 20 wt % of the flow regulator, and 0.5 wt % to 1.4 wt % of the storage stabilizer based on a total of 100 wt % of the composition;
- curing the epoxy adhesive composition at a temperature of 130° C. to 190° C.;
- and
- maintaining the cured composition at room temperature for at least 1 hour.
Dependencies are inferred from the claim text.